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1. The Free On-line Dictionary of Computing (30 December 2018)
Chip Scale Packaging

    (CSP) A type of surface mount integrated
   circuit packaging that provides pre-speed-sorted, pre-tested
   and pre-packaged die without requiring special testing.  An
   example is Motorola's Micro SMT packaging.

   See also: chip-on-board, flip chip, multichip module,
   known good die, ball grid array.

   ["Chip scale packaging gains at SMI. (Surface Mount
   International)", Bernard Levine, Electronic News (1991), Sept
   4, 1995 v41 n2081 p1(2)].

   (2006-08-14)


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